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based on a micromachining method designed to increase the fraction of a wafer that can be used to fabricate solar cells. Rather than starting with the thinnest wafers possible, this fabrication process starts with relatively thick disk-shaped wafers of single-crystal silicon and calls for slicing paper-thin rectangular sections from a wafer in a direction perpendicular to the wafer s face. The procedure greatly increases the silicon surface area and leads to a large number of long and very thin (about 50 µm) silicon slices or slivers, each of which is then fashioned into a solar cell


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