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BASF Electronic Materials/P C2's subsections
2006. 04.03.2006. TMP>CMP Slurries
2006. 06.26.2006. Head Global Dev.
2007. 11.19.2007. Opens EU Center
2008. 07.14.2008. Ceria CMP
2008. 07.14.2008. Director
2008. 08.04.2008. Bus. Director
2009. 07.13.2009. Group VP
2010. 04.22.2010. Cu Plating
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