| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 08.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Aq resin dispersion comprising partial bonded comp produced from - Acrylic resin - Aromatic epoxy resin comprising 0.2-1.5 of epoxy/mole - Bisphenol F prodt being reaction prodt of formol with bisphenol F compd.: CH2{[C6H3(CH2OH)]-OH}2 |
| PATENT PHOTOCOPY | Available on request |
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