| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 12.99 |
| PATENT ASSIGNEE | Toshiba KK |
| PATENT CLAIMS |
Resin compn comprising Epoxy compd.; Inorganic filler; & as Cure agent Polysiloxane; in which each the 2 organic groups bonded to each Si are Me & - -C6H4-OH |
| PATENT PHOTOCOPY | Available on request |
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