| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 07.99 |
| PATENT ASSIGNEE | Toshiba KK |
| PATENT CLAIMS |
Formed by simultaneously sintering Al nitride substrate & metal layer consisting of metal material - Tungsten (main comp) - Mn (0.001-2%) - Cu (0.0001-2%) |
| PATENT PHOTOCOPY | Available on request |
|
Want more information ? Interested in the hidden information ? Click here and do your request. |