PATENT ASSIGNEE'S COUNTRY | Japan |
UPDATE | 11.99 |
PATENT ASSIGNEE | This data is not available for free |
PATENT CLAIMS |
- Bisphenol-type epoxy resin - Phenolic hardener - Silica filler (> 85%) composed of 5-50% of synthetic silica & 95-50% of natural fused silica |
PATENT PHOTOCOPY | Available on request |
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