Main > ELECTRONICS. > SemiConductor > Device > Encapsulant > Epoxy Resin. Silica

Product Japan. T

PATENT ASSIGNEE'S COUNTRY Japan
UPDATE 11.99
PATENT ASSIGNEE This data is not available for free
PATENT CLAIMS - Bisphenol-type epoxy resin
- Phenolic hardener
- Silica filler (> 85%) composed of 5-50% of synthetic silica &
95-50% of natural fused silica
PATENT PHOTOCOPY Available on request

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