| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 12.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
- Sheet for expanding process comprising a film & formed thereon, a PSA layer & - Polyimide bonding sheet comprising a processing film & formed thereon, a polyimide adhesive layer With the processing film attached to PSA layer |
| PATENT PHOTOCOPY | Available on request |
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