| PATENT ASSIGNEE'S COUNTRY | Germany |
| UPDATE | 07.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Flame-resistant, flowable latently reactive phenol curable epoxy resin moulding compd for electronic comp. encapsulation - Epoxy resin comp. obtained from solvent-free reaction resin mixt of polyepoxy resin & polyisocyanate resin having a epoxy/-NCO molar ratio of 1.1:1 to 4:1 at < 220C in presen ce of reaction accelerator (0.5-2.5%) & triphenylphosphine oxide (0.05-10%) - Phenolic hardener contg > 2 phenolic -OH/mole. - Inorganic filler - Additives |
| PATENT PHOTOCOPY | Available on request |
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