| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 11.99 |
| PATENT ASSIGNEE |
Shinko Electric Industries (Naganoken) Uyemura C. & Co (Osaka) |
| PATENT CLAIMS |
Method of Ni electroplating a conductor partially masked with organic polymer resist layer comprising - Dipping said partially masked conductor in electroplating bath comprising water-soluble Ni salt in concn 5-40 g/l on basis of Ni ion equiv. & an ammonium contg electroconduc tive salt in concn 150-500 g/l & pH 3.5-5.4 - Applying current to bath using said conductor as cathode Whereby portion of conductor other than the area masked with resist layer is formed with a Ni film without floating or peeling of resist layer |
| PATENT PHOTOCOPY | Available on request |
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