| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 09.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Forming a resin layer on surface of a work; forming the resin layer into a prescribed pattern as a plating mask & executing electrolytic plating on surface of work in tin-silver-system alloy plating soln comprising - Tin compd - Ag compd - Bi compd - Pyrophosphoric compd - Iodic compd |
| PATENT PHOTOCOPY | Available on request |
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