| PATENT ASSIGNEE'S COUNTRY | France |
| UPDATE | 11.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Mold comprising - Sc (> 0.02%) - Lanthanide (> 0.02%) - Al (5-15%) - Ni (2-7%) - Fe (2-7 %) - Si (0.05-1.5 %) - Mn (0.02-2 %) - Zn (< 0.25 %) - Cu (Bal.) |
| PATENT PHOTOCOPY | Available on request |
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