| CLASSIFICATION | CommPat. Market |
| MARKET POSITION | > 50% world share |
| MARKETER'S COUNTRY | Japan |
| PATENT ASSIGNEE'S COUNTRY | Japan |
| PRODUCER'S COUNTRY | Japan |
| UPDATE | 01.99 |
| USES | Semiconductor chip encapsulation |
| MARKETING BY | This data is not available for free |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT PHOTOCOPY | Available on request |
| PRODUCTION BY | This data is not available for free |
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