| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 08.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Mfg method comprising electroplating an object of treat. in plating bath contg - Fe(II) & Ni(II) ions - Dispersing silica, alumina size < 30 nm Film having Co wt content > 50% |
| PATENT PHOTOCOPY | Available on request |
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