| PATENT ASSIGNEE'S COUNTRY | Germany |
| UPDATE | 08.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Currentless metallization process of electrically non-conducti ve substrates - Depositing on substrate a positive lacquwer comprising UV hardenable polymer, organometallic compd., & light activator substance (benzo diazoketone deriv) to provide positive lacquer coated substrate - Irradiating - Precipitating a metal layer onto irradiated coated substrate by currentless metallization in bath effective therefore |
| PATENT PHOTOCOPY | Available on request |
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