| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 06.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
- Bringing the bon-conductive material into contact with acidic hydrosol soln contg Pd compd.; stannous compd.; & Cu compd - Contacting material with aq alkaline soln - Electroplating |
| PATENT PHOTOCOPY | Available on request |
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