| PATENT ASSIGNEE'S COUNTRY | Taiwan |
| UPDATE | 07.99 |
| PATENT ASSIGNEE | National Science Council (Taipei) |
| PATENT CLAIMS |
CMP slurry for metal thin films - Solid abrasives (2.5-10%) - Protic acid to stabilize abrasive suspension - NaOH Slurry has pH 1-6 |
| PATENT PHOTOCOPY | Available on request |
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