| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 06.99 |
| PATENT ASSIGNEE | Mitsubishi Gas Chemical (Tokyo) |
| PATENT CLAIMS |
Mfg method - Applying conductive metal film on wafer - Applying photoresist on above film - Removing photoresist layer with HF based remover - Cleaning device by rinsing with rinse comprising water & peroxide compd |
| PATENT PHOTOCOPY | Available on request |
|
Want more information ? Interested in the hidden information ? Click here and do your request. |