| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 06.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Epoxy resin compn comprising epoxy resin, cure agent, cure catalyst & silica powder characterized by - Av. particle diam. < 30 micro-m - 5-30% of previously molten silica powder having an av. particle diam. < 7 micro.m & specific surface area > 5 square.m/g in the total silica content - 15-45% of silica having diam. < 5 micro.m - Max particle diam. < 150 micro.m - Silica content 70-82% in total compn |
| PATENT PHOTOCOPY | Available on request |
|
Want more information ? Interested in the hidden information ? Click here and do your request. |