| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 08.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Film forming method - Ejecting curable compn from spray gun - Exposing compn to active energy beam - Coating compn to form film - Heat curing Wherein compn comprises epoxy resin & cationic photoini tiator |
| PATENT PHOTOCOPY | Available on request |
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