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Co is commercializing a new method for producing faster computer chips with circuit lines just 0.13 micro.m wide, nearly 40% smaller than the 0.18-micro.m m lines on today's most advanced chips . The new manufacturing technique uses poly(phenylene) a low dielectric constant aromatic polymer--to shield copper circuit lines from each other. Commercial production of the chips will start next year in Burlington, Vt. Co.'s development to lead to the adoption of "brand" resin as the industry's dielectric material of choice, with annual sales in excess of $200 million at maturity.
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