| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 06.99 |
| PATENT ASSIGNEE | IBM (Armonk; NY) |
| PATENT CLAIMS |
Compn comprising thermoset polymeric matrix & conductive filler comp comprising - Electroconductive metal particles - Polyparaphenylenevinylene conductive polymer |
| PATENT PHOTOCOPY | Available on request |
|
Want more information ? Interested in the hidden information ? Click here and do your request. |