| CLASSIFICATION | Market |
| TECHNOLOGY |
The company's twist on the technology is a dual-layer resist. semiconductor fabricators first apply a thick underlayer, then deposit a thin imaging layer on top of it. The underlayer serves as a mask for subsequently etching the substrate while the thin layer provides the good lithographic properties needed for today's fine circuitry. Separating the imaging and etching functions in this way optimizes system performance, he says. |
| UPDATE | 07.02 |
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