| PATENT ASSIGNEE'S COUNTRY | USA |
| PROPERTIES | Improvement of Bonding of Cu foil to polymeric prepreg |
| UPDATE | 06.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
- Contacting metal foil with acidic soln - Placing foil in tank contg Ni treat bath & applying current through Ni treat bath, wherein tank comprises at least 2 pla ting zones, the Ni treat bath comprises 1 - 50 g/l of ammo nium salt & 10 - 100 g/l of Ni compd - Applying Ni flash layer to foil - Applying silane coupling agent to foil |
| PATENT PHOTOCOPY | Available on request |
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