| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 05.99 |
| PATENT ASSIGNEE | Dow Corning Toray Silicone (Tokyo) |
| PATENT CLAIMS |
- Cured Silicone in which there is dispersed - Organic Resin Powder Filler having surface that is electro conductive, diam. 0.01 - 500 micro-m & d. 0.01 - 0.95 & who se concn is higher in part remote from device than part adjoining device |
| PATENT PHOTOCOPY | Available on request |
|
Want more information ? Interested in the hidden information ? Click here and do your request. |