Main > ELECTRONICS. > SemiConductor > Device > Encapsulant > Epoxy Resin. > Patent Dispute Settlement

Product Japan. USA. DS

AGREEMENT This data is not available for free
LEGAL DISPUTES "S" will pay $46 million to "D" to settle lawsuit "D" claimed in a 1996 action that "S" was infringing its process patent
UPDATE 04.02
LITERATURE REF. This data is not available for free

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