PATENT ASSIGNEE'S COUNTRY | USA |
UPDATE | 08.99 |
PATENT ASSIGNEE | This data is not available for free |
PATENT CLAIMS |
Claim 13 - Applying to device compn contg polysilastyrene & filler - Heat. compn in O atm. at 50 - 1000C |
PATENT PHOTOCOPY | Available on request |
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