| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 06.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
- Immersing substrate as cathode & Sn-Ag alloy plate as anode in acid Sn-Ag alloy plating bath comprising Sn ions, Ag ions, aromatic thiol compd & water (balance); pH of bath < 2 - Charging electric current 0.5 - 50 A for 0.5 - 10 min to form a film comprising Sn (20 - 99 %) & Ag (80 - 1 %) & thickness 1 - 30 micro-m |
| PATENT PHOTOCOPY | Available on request |
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