| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 08.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
- Indium (7 - 11 %) - Silver (2.5 - 3.5 %) - Cu (0.5 - 1.5 %) - Tin (Balance) Solidus & liquidus T < 200C & reflow T < 240C |
| PATENT PHOTOCOPY | Available on request |
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