| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 09.99 |
| PATENT ASSIGNEE | Bergquist Co. |
| PATENT CLAIMS |
An interface material for interposition along a heat dissipating path between a solid state electronic device & heat sinking surface comprising blend (a) Thermally conductive particulate solid visc. stabr. (75-85%) selected from alumina etc (b) Polyorganosiloxane graft polymer (15-25%) consisting of methylsiloxane host & linear hydro carbon with the linear hydrocarbon comp of graft polymer having a single terminally positioned unsaturated linkage & represented by Me(CH2)nCH=CH2; n = 13-16 |
| PATENT PHOTOCOPY | Available on request |
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