| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 05.00 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
(a) Contacting first & second Cu-Cu oxide eutectic portions (I) with ceramics & metal (b) Heating to melt (I) but at T < melting point of Cu (c) Allowing (I) to solidify |
| PATENT PHOTOCOPY | Available on request |
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