| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 05.00 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
A process for the treat of a substrate, which comprises (1) coating the substrate with photoresist compn.; (2) selective irradiation of this photoresist coating at 193 nm wavelength; (3) Treat of the irradiated coating with a developer soln., whereby the resist coating is structured as an image; & (4) The image-structured resist coating is subjected to a treat., in which its imaged structure is not disturbed, & in which non-aromatic groups are converted to groups with aromatic structural elements; & wherein the photoresist compn comprises - (A) Compd which forms an acid under the effect of radia tion - A film-forming binding agent that is sufficiently transparent for radiation of 193 nm wavelength, & which has groups that can be cleaved by acid catalysis - (C) Compd with latent aromatic groups; or instead of comp (B) & (C) - (D) An alkali-soluble film-forming binding agent, which is transparent for radiation of 193 nm wavelength to provide a photoresist having an exctinction value < 0.8/micro.m in a solvent free state & which has both latent aromatic groups & groups that can be cleaved by acid |
| PATENT PHOTOCOPY | Available on request |
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