| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 07.00 |
| PATENT ASSIGNEE |
Alpha Metals of Japan Toshiba Corp |
| PATENT CLAIMS |
Low-melting alloy having good wettability consisting of - Sn/Pb/Bi base material compn comprising Sn (20-30%) Bi (15-35%) & Pb (Bal.) - Ag (0.1-5%) - Cu (0.05-1%) Alloy has bonding strength > 630 gf |
| PATENT PHOTOCOPY | Available on request |
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