| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 09.00 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Etching compn - R-245fa (etchant compd.) - Second different material to enhance or modify the plasma etching characteristics of etchant compd |
| PATENT PHOTOCOPY | Available on request |
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