| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 08.00 |
| PATENT ASSIGNEE | Aisin Seiki KK |
| PATENT CLAIMS |
A method of producing a conductive resin compn - Kneading a TP or thermosetting resin with a low MP alloy which has a MP lower than a molding T of said resin & a dispersing aid which includes at least one chemical ele ment of said low MP alloy - Molding resulting mixt Wherein the said alloy consists of tin & is in a melt while the mixt is molded |
| PATENT PHOTOCOPY | Available on request |
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