| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 09.00 |
| PATENT ASSIGNEE |
Advanced Technology Materials Infineon Technologies Corp |
| PATENT CLAIMS |
Method comprising - Simultaneously exposing an insulating portion & electrica lly conductive portion of substrate member to CVD process - During said process selectively CVD a Bi based ferrolectric thin film on electrically conductive portion |
| PATENT PHOTOCOPY | Available on request |
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