Main > ELECTRONICS. > Metals > Tantalum > Etching. by > CF4/O2 Plasma Dry Etch

Product USA. A

PATENT ASSIGNEE'S COUNTRY USA
UPDATE 07.00
PATENT ASSIGNEE Advanced Micro Devices
PATENT CLAIMS Method of etching tantalum
- Etching at least a portion of tantalum using tantalum etch
gas mixt comprising CF4 & O2 & using 900-1200 watts of
power
PATENT PHOTOCOPY Available on request

Want more information ?
Interested in the hidden information ?
Click here and do your request.


back