| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 06.00 |
| PATENT ASSIGNEE | Advanced Micro Devices |
| PATENT CLAIMS |
Method of mfg a semiconductor device on wafer - Forming Cu interconnection pattern comprising a dense array of spaced apart Cu lines bordering an open dielec tric field on a surface of the wafer - Chemically treating wafer surface with soln contg NH4F, diammonium H citrate, triammonium citrate, surfactant & de-ionized water |
| PATENT PHOTOCOPY | Available on request |
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