| PATENT ASSIGNEE'S COUNTRY | Germany. Japan |
| UPDATE | 10.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Semiconductor device comprising semiconductor element sealed with an epoxy resin molding material comprising (A) epoxy resin having > 2 epoxy groups/mole.; (B) Compd having > 2 phenolic -OH /mole. & (C) powder which (1) has a structure comprising core of solid silicone polymer & shell of organic polymer in wt ratio of solid silicone/organic polymer 1:1-5:1, (2) the solid silicone polymer comprising - 80-99.5% of (RR'SiO) unit - 0.5-20% of (RSiO3/2) unit - (SiO2) unit as crosslinking agent Wherein R = < 6C alkyl, aryl group or functional group having terminal C-C double bond, & R' = < 6C alkyl or aryl group Wherein solid silicone polymer contains 1-10% of siloxane units with C-C double bond |
| PATENT PHOTOCOPY | Available on request |
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