| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 09.99 |
| PATENT ASSIGNEE | Vacuum Metallurgical Co Ltd |
| PATENT CLAIMS |
Method of thin metal film forming on semiconductor substrate - Providing liquid organic dispersion medium - Dispersing in medium ultra fine powder of metal - Applying dispersion to substrate by spin coating - Heating substrate to evaporate medium & sinter metal - And to fill via hole, or trench with metal, & to cover the subs trate surface with thin & planar film of metal |
| PATENT PHOTOCOPY | Available on request |
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