Main > ELECTRONICS. > Glass > Metal. Structure > Stress. Redn > Buffer Layer

Product Taiwan. U

PATENT ASSIGNEE'S COUNTRY Taiwan
UPDATE 09.99
PATENT ASSIGNEE United Microelectronics Corp
PATENT CLAIMS Structure comprising in order
- Metallic layer
- Stress buffer layer generating compressive stress
- Spin-on-glass layer
PATENT PHOTOCOPY Available on request

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